The electronic functions in today's cars (Figure 1) continue to increase and will soon outweigh the value provided by mechanical functions. Electronic functions are also becoming the main competitive element of the model. The constraints of on-time delivery of models are no longer mechanical designs, but electronics and software. Therefore, it is necessary not only to quickly design these electronic components, but also to have high performance, quality and reliability standards. If they are less reliable and fail after the sale, the company will not only suffer huge warranty and recall costs, but also damage its reputation. For example, in 2011, Rolls-Royce had to recall 600 Ghost cars worth $250,000 because of overheated boards that could cause fires. People do not want such quality and reliability of the car to be such a danger.
The main source of heat for electronic devices is their semiconductor chips (ICs), which are very temperature sensitive, making the design of cooling solutions a challenge. Overheating can cause the chip to fail prematurely. With the increase of functions, the related heat dissipation problem has become increasingly prominent, which has become a potential constraint factor in the development of electronic equipment. For critical components, a proper cooling strategy is needed to prevent overheating and failure.
Below are some of the factors that enable thermal experts and designers to use efficient computational fluid dynamics (CFD) thermal simulation software during the design process, from concept to design exploration and optimization to final solution validation:
â— Let the products come to market in time. Even if it is only a few weeks later than planned, it may delay the delivery of new models, causing the car company to lose millions of dollars.
â— Allow designers to experiment with multiple designs. Create higher quality, better performance and more competitive products.
â— Reduce the number of prototypes. The opportunity takes a lot of money and time.
â— Deliver highly reliable products. Save the warranty and recall costs and maintain a good reputation.
Mechanical designers using Mechanical Design Automation (MDA) software are responsible for the structural design of all components except the integrated circuit (IC) and PCB. So they need to work with electronics designers who use Electronic Design Automation (EDA) software. In the past, the two areas of MDA and EDA typically only exchange data through IDF standards that pass all data. This method does not have a data filter that conveys heat-related information. This leads to too many design details brought into thermal analysis, so that CFD simulation either requires the designer to manually simplify the model, or it must withstand the excessive CFD run time or convergence caused by the model machine.
Figure 2: All automotive electronics, including electronic control units (ECUs) and pump controllers, require good thermal management
Why start with the conceptual design phase?
Good thermal management should begin at the conceptual stage of the development process. These products are often complex systems that require collaboration from several different background design departments: IC and (FPGA) engineers, PCB layout engineers, manufacturing engineers, software developers, reliability engineers, mechanical designers, marketing, radio frequency and High-speed electrical engineers and more. Decisions related to the viability of the product are required during the concept phase. It involves “Is the heat generated by the system effectively managed according to the given space, size specifications, desired performance and function?â€
By using Mentor Graphics' new FloTHERM XT solution, mechanical designers or thermal design engineers can easily create conceptual models of ICs, PCBs, and chassis, and then simulate to see if they can dissipate heat efficiently. If you can, then from a thermal management perspective, the design can go on. If the personnel of any other design department find it impossible to proceed after the concept phase, they may need to change the system's functional specifications, size specifications, devices used, or other factors. However, if problems are discovered and redesigned in the subsequent development process, the cost will increase significantly.
Another reason to consider thermal design from the conceptual stage of the development process is to provide guidance for subsequent detailed design. Before detailed design of a PCB or chassis, designers can easily create and compare multiple conceptual designs, then select the best solution and use that data to guide detailed system design.
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