In 1904, the British Fleming invented the world's first electronic tube, which marked the human era into the electronic age. Since then, the tube technology has been widely used. The world's first electronic computer "ENIAC" is made of electronic tubes. However, in use, people find that the electron tube has the defects of large volume, large power consumption, large heat generation, high cost, fragile structure and short life. This forces people to study more advanced electronic components instead of tubes.
In 1947, Shockley, Badin, and Bratton of Bell Labs invented transistors, and humans entered the era of microelectronics. In electronic products, electron tubes are gradually being replaced by transistors, and transistors have become the mainstream products in the era of microelectronics.
The development of integrated circuit technology in the 1960s made it possible to miniaturize transistors, and the integration of hundreds of transistors on a single chip became a reality. The ever-shrinking of transistor size has led to an increase in the number of transistors integrated on a single chip. The scale of integrated circuits has also evolved from small-scale (SSI) to large-scale, ultra-large-scale, very large-scale, and large-scale. The following table shows the scale of integrated circuit integration. development of.
The rapid development of integrated circuits has led to an increase in the integration of chips, which has led to the adoption of semiconductor chips in more and more products. Packaging is a key step in the practical application of semiconductor chips. In the broad sense, electronic packaging refers to the packaging and assembly of various electronic components, including a first-level package, a second-level package, and a three-stage package. Narrowly defined electronic packaging refers to the protection of semiconductor chips or components.
The package has four main functions: first, to protect the LED chip from the external environment; second, to provide heat dissipation channels for the chip; third, to provide mechanical support for the chip; and fourth, to provide electrical connection for the chip. Since the birth of microelectronics technology, chip design, chip manufacturing, packaging and testing have become the three most important aspects of microelectronics technology. The industry generally believes that these three links account for one-third of the total cost of microelectronic products. Therefore, research on high-reliability packaging technology is of great significance for improving product yield and controlling cost.
Since the birth of the first transistor in 1947, packaging has emerged. After nearly 70 years of development, packaging technology has made great progress. The following figure shows the development of packaging technology.
Prior to the 1980s, semiconductor packages used dual-in-line package technology (DIP) with 4 to 64 pins. It is mainly mounted on the circuit board using perforation technology. Low packing density and low efficiency make it difficult to meet automated production requirements.
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