TSMC's 2011 Capital Expenditure Plan

TSMC announced that its capital expenditure in 2011 will reach 7.8 billion U.S. dollars, mainly for the expansion of 65, 45 and 28 nanometer production capacity. Among the RMB 7.8 billion in capital expenditures, 81% will be used to expand the 65, 45 and 28nm production capacity, and 9% of the 81% will be used for R&D of 20nm and 14nm. The total production capacity in 2011 is expected to be It will grow 20%, of which 12% capacity will increase by 35%. In terms of more advanced manufacturing processes, TSMC is currently developing a 20-nanometer manufacturing process at Hsinchu Wafer No. 12 Plant, and will add R&D centers of 14nm and sub-14nm processes. In addition, TSMC will conduct trial production of 18-inch wafers on 20-nanometer process from 2013 to 2014, and it is expected to produce in volume at the 15th wafer factory of China Keke from 2015 to 2016.