Vishay molded é’½ chip capacitors new form factor

SMD aluminum electrolytic capacitor

Chip ceramic capacitor

Patch Murata capacitor

Tantalum capacitor

Recently, Vishay Intertechnology, Inc. (NYSE: VSH) announced the addition of a W form factor (EIA 7316) for the popular low-ESR TR3 high-capacity, high-voltage molded é’½ chip capacitor . The new form factor is 7.3mm x 6.0mm and 3.45mm high, extending the capacity and voltage range of the capacitor beyond the existing A to E form factor.

Following the recent release of Vishay's 63V and 75V tantalum capacitors, the release of the low-ESR TR3 W form factor further confirms the company's commitment to provide the best specifications with robust design, highest voltage, and the industry's highest capacity. Vishay will release the W form factor version for all its molded tantalum capacitors in the coming months.

With W-shaped capacitors, designers can reduce the number of components in their applications. Previously they were able to use multiple capacitors in parallel to achieve the large capacity required for energy storage. This reduces board space, reduces costs, and increases reliability in communications base stations, data storage and high-end computing, industrial computers, automotive, military applications, and other applications such as medical instruments.

Vishay's molded tantalum capacitors are packaged to meet the needs of more applications in a variety of market segments, such as DC/DC output filtering in high-density boards or low-voltage distributed power boards.

Low ESR TR3 is RoHS compliant and is suitable for high speed automatic or manual pick and place equipment and can withstand lead free reflow.

Samples are available for low-ESR TR3 molded tantalum capacitors in W form factor and will be available in volume production in the second quarter of 2011. The lead time for major orders is eight weeks.