The iPhone 6 Plus was finally released in mainland China on October 17. Compared with the old iPhone 5 models and even the iPhone 6 launched at the same time, the iPhone 6 Plus has significantly improved hardware and performance. The iPhone 6 Plus with some new sensors is even better in overall performance, not only has improved endurance, but also a more comfortable user experience, once again showing Apple's unique engineering capabilities and ultimate user experience. Although you have seen the foreign pre-release analysis, do you really understand the new technology used in the iPhone 6 Plus? Or please follow the SITRI professional analysis team to explore this new Apple innovation in the sensor!
This article refers to the address: http://
The iPhone 6 Plus has not revolutionized the use of sensor types, but we have seen some changes in the choice of sensor suppliers. The iPhone 6 Plus uses accelerometers, gyroscopes, electronic compasses, barometers, fingerprint sensors, proximity and ambient light sensors, MEMS microphones and Image Sensors as detailed below.
Inertial sensor
Compared to the previous two generations of the iPhone 5 and iPhone 5S, Apple's inertial sensor suppliers have changed. The iPhone 5 uses a three-axis accelerometer from STMicroelectronics; the iPhone 5S uses a three-axis accelerometer and a three-axis gyroscope, the accelerometer comes from Bosch, the gyroscope comes from ST ST; in the iPhone 6 Plus, Invensense replaced ST ST.
The iPhone 6 uses two inertial sensors, one is Invensense's 6-Axis accelerometer and gyroscope MPU-6700, and the other is BOSCH's 3-Axis accelerometer BMA280.
MPU-6700
The MPU-6700 is available in a 3mm x 3mm x 0.9mm package with no change in package size compared to the previous MPU-6500.
MPU-6700 Package Photo:
The MEMS design of the MPU-6700 and MPU-6500 is almost identical, but the ASIC is partially different.
MPU-6700 ASIC Die Mark
MPU-6700 MEMS Die Photo
MPU-6700 MEMS Die Mark
BMA280
The BMA280 package measures 2mm x 2mm x 0.95mm.
Package Photo
ASIC Die Photo
ASIC Die Mark
MEMS Die Photo
MEMS Die Mark
Air pressure sensor
For the first time, Apple uses a barometric pressure sensor on its mobile phone. The iPhone 6 Plus uses Bosch's BMP280, which measures 2.5mm x 2mm x 0.95mm.
Package Photo
ASIC Die Photo
ASIC Die Mark
ASIC portrait
MEMS Die Photo
MEMS Die Mark
MEMS portrait
Electronic compass
The iPhone 6 Plus uses the same electronic compass as the previous two generations, but the version is slightly different. It is the AK8963C from AKM, and its package size is 1.6mm x 1.6mm x 0.5mm.
Die Photo
Die Mark
Vertical basic structure
Polymagnetic plate and coil longitudinal structure
Light sensor
The iPhone 6 Plus also uses the previous design in the use of light sensors, using separate proximity sensors and ambient light sensors. Like the iPhone 5, the ambient light uses the TSL2581 from AMS.
Proximity Sensor Package Photo
Proximity Die Photo
TSL2581 Ambient Sensor Package Photo
TSL2581 Ambient Sensor Die Photo
TSL2581 Ambient Sensor Die Mark
Fingerprint sensor
The iPhone 6 Plus uses the fingerprint sensor TMDR92 from the previous generation iPhone5S. The TMDR92 uses capacitive touch technology to capture skin fingerprint images.
Package Photo
Die Photo
Die Mark
Sample
MEMS microphone
Since Apple used the third microphone on the back of the iPhone 5 for noise reduction for high-definition video recording, the architecture of the three microphones quickly became the industry standard, and the iPhone 6 Plus still uses this architecture. One of the iPhone 3's three microphones comes from Lou's. Two of the iPhone 5S's three microphones are from Lou's, but in this iPhone6 ​​Plus, we didn't find a product from Lou's. Does this mean Apple? Some adjustments have been made in the supplier selection of microphones. Will the microphone market pattern change this year and next?
Microphone 1
Package Photo
ASIC Die Photo
ASIC Die Mark
MEMS Die Photo
MEMS Die Mark
MEMS Die OM proofs
MEMS Die SEM proofs
Microphone 2
Package Photo
MEMS Die Photo
MEMS Die Mark
MEMS Die proofs
Microphone 3
The microphone comes from ST, and the MEMS die comes from Omron. The package size is 3.36mm x 2.54mm x 1.0mm.
Package Photo
ASIC Die Mark
MEMS Die Photo
MEMS Die Mark
MEMS Die proofs
Image Sensor
According to feedback from users, the imaging effect of the iPhone 6 Plus has been greatly improved compared to the previous generation. What kind of technology has achieved a well-received camera module? SITRI will disassemble it in detail, so stay tuned for SITRI's follow-up sharing.
72V 150Ah Power Battery,72V Power Battery,72V Outdoor Power Supply,Power Station Household Outdoor Camping
Sichuan Liwang New Energy Technology Co. , https://www.liwangnewenergy.com