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Switch uses modular structure with flexible combination. Its case uses DMC UPR (unsaturated polyester resin) glass fiber reinforced plastic, having high dielectric properties, protection capacity and reliable safety operation performance.
Operating mechanism uses accelerating mechanism of spring storage and instantaneous release, double break contact mechanism of instantaneous making and breaking. Switch operating force has nothing to do with operating handle, which greatly improves electrical and mechanical performance.
NLGL Series load isolating switch is applicable to low-voltage power distribution system with AC 50Hz, rated working voltage 400V, rated working current reach to 3150A and below for power supply unfrequented making and breaking. As isolating switch in normal load, or over current or off-state circuits.
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Standard:
GB 14048.3-2008, 1EC60947-3:200S
Main Specification and Techical ParametersÂ
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| Frame Size Current (A) | 63 | 100 | 160 | 250 |
| Rated Working Voltage (V) | 400 | 400 | 400 | 400 |
| Rated Current (A) | 32,40,50,63 | 80,100 | 125,160 | 200,250 |
| Rated Insulation Voltage (V) | 690 | 690 | 750 | 750 |
| Dielectric Strength (V) | 5000 | 5000 | 5000 | 5000 |
| Uimp (kV) | 6 | 6 | 8 | 8 |
| kW | 0.756 | 1.2 | 5 | 12 |
| Icw (kA) | 1.07 | 1.7 | 8 | 24 |
| Mechanical Life | 10000 | 10000 | 10000 | 10000 |
| Operation Torque (N.m) | 4.5 | 4.5 | 6.5 | 10 |
| Frame Size Current (A) | 630 | 1600 | 3150 |
| Rated Working Voltage (V) | 400 | 400 | 400 |
| Rated Current (A) | 315,400,500,630 | 100,1250,1600 | 2000,2500,3150 |
| Rated Insulation Voltage (V) | 1000 | 1000 | 1000 |
| Dielectric Strength (V) | 8000 | 10000 | 10000 |
| Uimp (kV) | 12 | 12 | 12 |
| kW | 20 | 30 | 45 |
| Icw (kA) | 30 | 63 | 80 |
| Mechanical Life | 5500 | 4000 | 2500 |
| Operation Torque (N.m) | 14.5 | 27 | 60 |
Microwave PCB
microwave PCB`s is a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB`s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.
The advantages of using materials with a low X, Y and Z CTE is a resulting PCB structure that will remain extremely stable in high temperature environments while operating at up to 40 GHz in analog applications. This allows for the effective placement of very fine pitch components including, in some cases, bare die-attach. Additionally, the low CTE materials will facilitate the alignment of multiple layers and the features they represent in a complex PCB Layout.
Features
.CTEr = +40/+50 ppm per °C (low); Tg (glass transition temperature) is 280°C
.ER = 3.38/3.48 at 10.0 GHz
.ER is constant to 40.0 GHz
.ED (electro-deposited) copper only
.Layer-to-layer thickness control = +/- 0.001
.Fabrication costs are typical to slightly increased
Microwave PCB
Microwave PCB,Microwave Frequency PCB,Bare Copper Microwave PCB,High Frequency PCB
Storm Circuit Technology Ltd , http://www.stormpcb.com