With the rapid rise of the LED industry, EMC has gradually begun to be used in LED packaging applications due to its high heat resistance and suitable for large-scale modern production, providing an excellent solution.
Although it contains unlimited business opportunities, for domestic packaging companies, the current expansion of EMC means that it faces great risks and huge cost investment. Since EMC is developed by Japan, the main core technologies are in the hands of Japanese companies. Raw materials and equipment involved in EMC stent production need to be imported from Japan.
“EMC packaging is a technology introduced from the semiconductor industry. The raw materials, equipment and processes are quite different from traditional packaging.†Shenzhen Sentai Electronics Co., Ltd., one of Taiwan’s Changhua EMC bracket agents (hereinafter referred to as “Sen†According to Xin Yaqiao, general manager of the company, EMC will not only bring about changes in packaging manufacturers, but also related brackets and equipment manufacturers will change, which will have a great impact on the traditional PPA and ceramic bracket market.
It is understood that enterprises should set up an EMC stent production line, and their investment in equipment is at least 10 million, and the production of raw material epoxy resin is still monopolized by foreign companies, and the price is expensive, and the most direct consequence of this is the EMC bracket. The price has always been high.
In addition, domestic EMC packaging still has many problems to be solved at the technical level. For example, the performance of epoxy resin after curing is brittle, which may cause "injury" to the lamp bead itself during the process of material removal; The red ink experiment of the package air tightness test has also been a headache for domestic packaging manufacturers.
"In addition to Tiandian Optoelectronics, for EMC packaging, several LED packaging manufacturers in China are basically only experientially expanding production, and the production capacity will not be too large." A research and development director of Jingtai Optoelectronics told reporters that the domestic packaging factory The evaluation of EMC packaging projects began in 2012, and it has been three to five years behind in Japan, South Korea and other regions.
According to the above-mentioned supervisor, Jingtai Optoelectronics has developed the EMC3030 model using EMC brackets. It has been mass-produced and sold in August 2013, but the related orders have grown steadily. "It takes a while for any new product to be accepted by the market. At present, the domestic EMC price is still high, but if the cost can be controlled, the market will grow very fast, and this may take one to two years." The research and development director said.
However, Wen Xinghua, director of semiconductor sales in Seoul, said that since the beginning of this year, the demand for EMC packaging devices in the backlight market in Japan and South Korea has increased, so the EMC products produced by them are selling well.
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