As in the past years, TSMC has also produced amazing new technology at this year's conference. Its new process roadmap includes CMOS, Analog, MEMS, RF and other fields. The following are observations and feelings about the meeting during the day's meeting;
1. Morris Zhang regained control of TSMC last year at the age of 79. At that time, it was in the chaotic era of the global IC industry, and it re-launched. However, seeing Zhang at this meeting is still as energetic and talkative as it was when he first saw it in 1990. More importantly, after the company experienced the 40nm storm, it seems to reshape its confidence for customers and re-investment in the company under its helm, R & D and recruitment strategy, Zhang believes that the company will be 25,000 from today Expanded to 29,000 people.
In short, TSMC has returned to an era that has made its competitors feel "annoyed."
2. At this meeting, Zhang took several opportunities to reiterate the need to expand production capacity. Why? Recently, many companies are selling production lines and some customers are cheering about capacity expansion, but I feel that TSMC is very cautious in expanding capacity.
Last year, due to the decline of the IC industry, the gross profit margin was low, and the industry is booming this year. So there is no reason for TSMC to stir up the situation? On the other hand, TSMC has some new competitors, and it also wants to replace the crown of the workers.
3. TSMC is a company full of confidence. Sometimes it is a bit arrogant. It is not a bad thing for global OEMs. TSMC has barely met real competitors, including IBM and Samsung.
If it were me, TSMC should be a little uneasy because the competition among OEMs is increasing. For example, GlobalFoundries is fierce through mergers and investments, and Samsung is not good at its foundry.
Recently, TSMC has provided some associations to its opponents due to the 40nm process problem. This is a worrying experience. Now, I heard that the problem has been solved and I believe that the battle will continue.
Other surprises
4.TSV, postponed? As chip size shrinks more and more difficult, it is obvious that another variant of 3D three-dimensional integrated through-silicon via technology will attract industry attention. At this year's meeting, TSV technology was a bit low-key, and did not give a timetable for technical progress or a report on real progress. Jiang Shangyi, vice president and head of R&D department of TSMC, also admitted that TSV is still in its infancy.
TSMC believes that the complexity of cost and technology is still a problem for TSV, so it may delay the progress.
5. In the field of foundry, TSMC is in a leading position. TSMC will jump directly from 28nm to 20nm, while skipping 22nm and half contact.
What will be after 20nm? Jiang believes that TSMC's CMOS planar process last year was 20nm. From the perspective of silicon structure, TSMC supports the next-generation FinFET. In recent years, TSMC has been paying attention to the FinFET of double-gate transistors. Surprisingly, it has been decided that TSMC will make a decision this year, and other chip manufacturers are developing multi-gate structures.
6. TSMC broke ground to build LED factory in March and held the opening ceremony of R&D center and LED chip factory.
This move indicates that TSMC is transitioning from silicon foundry to other fields. In fact, it is producing LEDs, not OEM activities, but manufacturing under the TSMC brand. But insist that it will not compete with customers.
7. TSMC will not give up solar energy. Like LEDs, TSMC will also make photovoltaic modules according to its own brand, instead of solar energy OEM. Although the specific details are unknown, TSMC is very likely to jump directly into the construction of solar power plants.
1. Morris Zhang regained control of TSMC last year at the age of 79. At that time, it was in the chaotic era of the global IC industry, and it re-launched. However, seeing Zhang at this meeting is still as energetic and talkative as it was when he first saw it in 1990. More importantly, after the company experienced the 40nm storm, it seems to reshape its confidence for customers and re-investment in the company under its helm, R & D and recruitment strategy, Zhang believes that the company will be 25,000 from today Expanded to 29,000 people.
In short, TSMC has returned to an era that has made its competitors feel "annoyed."
2. At this meeting, Zhang took several opportunities to reiterate the need to expand production capacity. Why? Recently, many companies are selling production lines and some customers are cheering about capacity expansion, but I feel that TSMC is very cautious in expanding capacity.
Last year, due to the decline of the IC industry, the gross profit margin was low, and the industry is booming this year. So there is no reason for TSMC to stir up the situation? On the other hand, TSMC has some new competitors, and it also wants to replace the crown of the workers.
3. TSMC is a company full of confidence. Sometimes it is a bit arrogant. It is not a bad thing for global OEMs. TSMC has barely met real competitors, including IBM and Samsung.
If it were me, TSMC should be a little uneasy because the competition among OEMs is increasing. For example, GlobalFoundries is fierce through mergers and investments, and Samsung is not good at its foundry.
Recently, TSMC has provided some associations to its opponents due to the 40nm process problem. This is a worrying experience. Now, I heard that the problem has been solved and I believe that the battle will continue.
Other surprises
4.TSV, postponed? As chip size shrinks more and more difficult, it is obvious that another variant of 3D three-dimensional integrated through-silicon via technology will attract industry attention. At this year's meeting, TSV technology was a bit low-key, and did not give a timetable for technical progress or a report on real progress. Jiang Shangyi, vice president and head of R&D department of TSMC, also admitted that TSV is still in its infancy.
TSMC believes that the complexity of cost and technology is still a problem for TSV, so it may delay the progress.
5. In the field of foundry, TSMC is in a leading position. TSMC will jump directly from 28nm to 20nm, while skipping 22nm and half contact.
What will be after 20nm? Jiang believes that TSMC's CMOS planar process last year was 20nm. From the perspective of silicon structure, TSMC supports the next-generation FinFET. In recent years, TSMC has been paying attention to the FinFET of double-gate transistors. Surprisingly, it has been decided that TSMC will make a decision this year, and other chip manufacturers are developing multi-gate structures.
6. TSMC broke ground to build LED factory in March and held the opening ceremony of R&D center and LED chip factory.
This move indicates that TSMC is transitioning from silicon foundry to other fields. In fact, it is producing LEDs, not OEM activities, but manufacturing under the TSMC brand. But insist that it will not compete with customers.
7. TSMC will not give up solar energy. Like LEDs, TSMC will also make photovoltaic modules according to its own brand, instead of solar energy OEM. Although the specific details are unknown, TSMC is very likely to jump directly into the construction of solar power plants.
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