"After integration, Roma will lock three product lines in the future: First, LED, from LED driver, LED backlight to LED lighting products, the entire industry chain will be connected. Second, the next generation of power devices, mainly using SiC new materials to develop SBD (Schottky diode) and SiCMOSFET (semiconductor field effect transistor). The third is the Sensor, the development of a wide range of MEMS accelerometers, etc.. Li Jun, general manager of the China Design Center of Roma Semiconductors, at the China Hi-Tech Fair The reporter emphasized the strategic layout of Roma. After more than 50 years of development, Roma is building up strength for a new outbreak.
Three major product lines accumulate advantages
"Rohm's advantage in the LED field is high brightness, small size, and provide a complete solution." Li Jun pointed out. ROHM has introduced the world's smallest and thinnest patch LED PICOLED-mini series, showing Roma's leading position in this field. At the exhibition, the reporter saw the LED driver solution developed by Roma for the front and rear of the car. According to the staff of the exhibition, the LED driver solution of the front end has high efficiency, strong anti-interference and good heat dissipation. At present, customers have ordered Roma products.
The rise in markets such as hybrid vehicles, electric vehicles, and wind power has driven demand for power devices. It is important to increase the conversion efficiency from electrical energy to mechanical energy when the device is driven. This requires reducing the losses that occur in the gear and drive shaft sections, and installing the power components inside the motor reduces its losses. “The traditional Si module cannot be installed inside the motor because it can't withstand the high temperature working environment of 200 degrees Celsius. In addition, it needs a lot of heat dissipation equipment, low efficiency and high loss.†Li Jun said, “and the SiC module is not only Can work at this high temperature, and it can be more miniaturized, the volume is reduced by about 50%. At the same time it can dissipate heat from the back and surface, so it is more efficient." Roma acquired SiC wafer supplier Germany last year. SiCrystal, while the pre- and post-processes are concentrated in the ROHM branch, thus establishing a one-stop production system for SiC devices. Li Jun introduced: "At present, its Schottky diodes have been mass-produced, and SiCMOSFETs will enter the market next year."
Last year, Roma merged with Kionix, which excels in the field of accelerometers, to further strengthen Roma's strength in the sensor field. ROHM demonstrated single-chip light sensing and proximity sensor ICs for devices such as cell phones and digital cameras that respond to contactless motion detection. According to the exhibition staff, one of the largest application areas of sensors is mobile phones, which mainly require light sensors, proximity sensors, acceleration sensors, etc. The ROHM light sensor and proximity sensor realize “two in one†and realize the industry's first innovation. Non-contact motion detection. In the future, ROHM will also consider launching a "triple-in-one" chip integrated with an acceleration sensor based on market demand.
Strengthening the layout of China
The Chinese market has always been one of the most important markets for Roma. Today, it has formed a sales network with 4 sales companies and 15 liaison offices. It has established development centers in Shanghai, Shenzhen and Hong Kong, and established in Dalian and Tianjin. The production base, that is, built a one-stop system integrating development, sales and manufacturing in China. Li Jun said that in order to quickly respond to the requirements of the expanding Chinese market, Roma plans to continue to expand its sales network in China, and the focus in the future is to further promote localization.
Li Jun said that the strategy of ROHM's localization in China is:
First, the previous development from wafer fabrication to product development was mainly done in Japan, and the development center in Shanghai is currently developing the entire industry chain.
The second is to develop a product development roadmap for the needs of China's domestic market. For example, through cooperation with Tsinghua University, it is committed to the development of DTMB China's terrestrial digital TV signal receiving chip. Currently, a demodulation chip has been introduced, which has the advantages of built-in AD converter and SDRAM. Good noise resistance.
The third is to provide solutions for local applications. For example, the demand for the Chinese Internet of Things market is concentrated on sensors, memory and communication modules. ROHM will focus on the main push sensor, the second is to develop EEPROM, and the third is to develop communication standard modules such as ZigBee modules.
It is worth mentioning that in 2006, ROHM signed a joint industry-university agreement with Tsinghua University to actively carry out joint development of industry and education on the most advanced technology of electronic components. The Tsinghua Rom Electronic Engineering Museum, which was built by Rom in about 2 billion yen at Tsinghua University, is expected to be completed in April 2011.
In response to the needs of the Chinese market, ROHM's wide product line enables it to expand its capabilities in various applications, including power devices, MCUs, sensors, general-purpose memories, audio and video processing ICs, SiC modules, wireless communication modules, display technologies, etc. . Li Jun mentioned that in addition to providing Bluetooth and ZigBee RF technology, wireless communication will develop Wi-Fi RF products in the future.
“Rom has a Chinese sales and development team that not only emphasizes the rapid response to customer needs, but also pays great attention to customer service such as technical services, and constantly improves the design system to provide corresponding products and solutions.†Li Jun stressed Say.
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