<Test Technology> Application of infrared thermal imaging technology to measure the surface temperature of electronic components under normal operating conditions Measurement of component surface temperature. This paper discusses how to obtain the true surface temperature of an electronic component under the normal working conditions of electronic components, involving the correct estimation of background temperature and target temperature, the selection of transparent materials, the estimation of transmittance, errors and possible correction methods.
*: 2001-0 å±® 10 1 Preface The current infrared thermal imaging technology is developing rapidly. At the same time, the thermal control of electronic components is becoming increasingly important. The application of infrared thermal imaging technology to the measurement of the surface temperature of electronic components is of great significance to the cooling research of electronic systems.
Compared with other temperature measurement methods, modern infrared cameras have many advantages. They can perform fast, non-contact and non-invasive temperature measurement, and can display the temperature distribution of the measured surface on a thermal image. In addition, its post-processing software has multiple functions and can be used for analysis and research for various purposes.
As we all know, the current numerical simulation based on computational fluid dynamics (CFD) has been widely used in the thermal evaluation and thermal design of electronic products, but it is very necessary to perform some experimental verification on the numerical simulation results. Because the electronic components to be measured are often non-isothermal, the traditional thermocouple temperature measurement sometimes cannot meet the requirements, and the infrared thermal imager can just make up for this defect. Another use of thermal imaging cameras is to directly detect components that may overheat and defective components in printed circuits under various operating conditions.
Under normal circumstances, the necessary condition for measuring the true temperature with an infrared camera is to obtain the blackness and background temperature of the surface of the measured object. The temperature measurement of electronic components is more complicated, because the components in electronic products are rarely exposed to the outside, but are enclosed in a closed box, so that the thermal imaging camera can not shoot the components that need to be measured. Some people have tried to use the time-reduction method to guess the true temperature of the component. This method turns off the power, quickly removes the component to be tested and takes a picture of it, and then theoretically pushes back the true temperature of the component under normal operating conditions based on the temperature of this thermal image . and also
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